Bond

Operations Project Manager

Ohio, United States

Not SpecifiedCompensation
Mid-level (3 to 4 years), Senior (5 to 8 years)Experience Level
Full TimeJob Type
UnknownVisa
Data Center, Manufacturing, EngineeringIndustries

Requirements

Candidates must possess at least 3 years of project management experience and 3 years of field service experience, preferably in large project installations within new construction. A strong mechanical aptitude and understanding of electromechanical systems and Cooling Distribution Units (CDU) are required, along with hands-on experience in construction, field service, or maintenance trades. Experience managing contractors and field service activities for over 3 years is necessary, and an Associate's degree in a related field, with engineering preferred, is expected. Project Management experience, with PMI or PMP certifications being preferred, is also a requirement. Preferred qualifications include a Bachelor's degree in project management or engineering, PMP or PMI certification, experience with Liquid Cooling technologies, and knowledge of PLC functions and interfacing.

Responsibilities

The Project Manager will oversee the installation and testing of Boyd's thermal cooling systems within a customer's data center facility, ensuring proper functioning of all components and timely project completion. They will manage Boyd's project team, partner with the customer's project team and construction trades to meet deadlines, and coordinate with the customer's general contractor to align the thermal cooling project schedule with overall building plans. Responsibilities include troubleshooting cooling system issues, replacing subassemblies, performing system tests, ensuring contractor compliance with contracts, mediating team conflicts, issuing daily reports, noncompliance notices, and cost/expense logs, reviewing project milestones, determining project progress, reporting weekly project status and customer satisfaction to management, communicating project status changes to Boyd management, and performing product commissioning and customer hand-over.

Skills

Project Management
Thermal Cooling Systems
Installation
Testing
Data Center Operations
Construction Coordination
Troubleshooting
System Testing
Contract Compliance
Conflict Resolution
Team Leadership

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters
2019Year Founded
$40.9MTotal Funding
SERIES_ACompany Stage
Fintech, Financial ServicesIndustries
51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.
Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.
FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.
The platform ensures compliance with federal regulations, easing the burden on clients.
Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.
Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.
Rising interest in secured credit cards opens new markets for Bond.

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