Sales Manager at Bond

Taipei, Taiwan

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Not SpecifiedCompensation

Mid-level (3 to 4 years), Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

SemiconductorIndustries

Requirements

Diploma or Bachelor’s degree in Microelectronics Engineering, Marketing, or a related field
Sales experience in the semiconductor or related industry is preferred
Familiar with semiconductor testing equipment and markets
Strong customer service and relationship management skills
Excellent communication and negotiation skills
Ability to work independently in a fast-paced environment and as part of a team
Willingness to travel frequently to meet customer needs and develop markets

Responsibilities

Develop and execute sales strategies to increase market share for semiconductor testing products
Identify and develop new sales opportunities, including potential customers and markets. Maintain and strengthen relationships with existing customers to ensure satisfaction and loyalty
Collaborate with the R&D team to provide professional product demonstrations and technical support
Prepare and submit sales reports, including market analysis, customer feedback, and sales forecasts
Attend industry trade shows and conferences to increase the visibility of the company and its products

Skills

Business Development

Sales Strategy

Customer Relationship Management

Negotiation

Market Analysis

Product Demonstration

Semiconductor Testing

Trade Shows

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters

2019Year Founded

$40.9MTotal Funding

SERIES_ACompany Stage

Fintech, Financial ServicesIndustries

51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.

Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.

FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.

The platform ensures compliance with federal regulations, easing the burden on clients.

Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.

Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.

Rising interest in secured credit cards opens new markets for Bond.

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