Requirements

Candidates should possess a Bachelor's degree in Electrical Engineering, Physics, or a related scientific discipline, along with 5+ years of relevant experience in PCB layout/routing design, stack-up and impedance calculations, and high-speed routing techniques. They must be proficient with Cadence Allegro for board layout and Cadence ORCAD for schematic designs, and have a thorough understanding of the relationship between physical layout and electrical performance, RF performance, and emissions. Experience with multilayer PCB manufacturing processes, including HDI, standard thru-hole and blind/buried vias and back-drilling, as well as rigid, rigid-flex and flex design and manufacturing, is required. Knowledge of signal integrity and transmission line concepts, such as phase matching, crosstalk, insertion/return loss, termination, BGA breakout, fab material selection, etc., is also necessary. U.S. citizenship and the ability to obtain and maintain a security clearance are required, with Active SSBI being a plus.