Senior Enterprise Solution Architect
Altium- Full Time
- Senior (5 to 8 years)
Candidates should have a Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a related field, with advanced degrees or certifications being a plus. A minimum of 10 years of experience in PCB layout design focused on high-speed signaling, power distribution, and HDI stack-ups is required, ideally for high-performance data center products. Proficiency in Cadence Allegro PCB design tools is essential, along with in-depth knowledge of high-speed digital design principles including signal integrity and impedance control. Experience with complex HDI PCB design and manufacturing processes, as well as an understanding of power distribution network design and thermal management techniques for data center applications, is necessary. Strong problem-solving skills are also required.
The Senior Layout PCB Engineer will lead the design and optimization of high-speed PCB layouts using Cadence Allegro for 100G signaling. Responsibilities include implementing strategies for impedance matching, trace routing, and crosstalk mitigation to ensure robust designs. The engineer will develop and implement power distribution networks for high-performance data center hardware, designing power planes, decoupling strategies, and thermal management solutions. Additionally, they will manage the design of complex HDI PCB stack-ups for multi-layer boards, integrating blind/buried vias and microvias to enhance signal integrity. Collaboration with electrical and mechanical engineering teams will be necessary to integrate PCB designs within the overall system architecture, providing input during design reviews to optimize performance and manufacturability.
Develops servers for transformer inference
The company specializes in developing powerful servers for transformer inference, utilizing transformer architecture integrated into their chips to achieve highly efficient and advanced technology. The main technologies used in the product are transformer architecture and advanced chip integration.