Sr. Technical Program Manager, Packaging at Tenstorrent

Toronto, Ontario, Canada

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Not SpecifiedCompensation

Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductors, AIIndustries

Requirements

5-10 years of experience in electronics packaging, with a diverse background spanning multiple areas such as process, material selection, and advanced packaging technologies
Proactive problem-solver with strong organizational skills and a track record of successfully managing complex technical projects
Excellent communication skills, enabling effective collaboration with cross-functional teams and external partners
Detail-oriented, adept at prioritizing tasks, and thrive in a fast-paced, innovative environment

Responsibilities

Oversee relationships with external vendors, ensuring timely delivery of components and adherence to quality standards
Support the qualification process for packaging solutions, including testing and validation to meet performance and reliability requirements
Create and maintain project schedules, defining clear milestones to drive progress and ensure on-time delivery
Document meeting minutes accurately and follow up on action items to keep projects on track
Update and manage tickets in Jira to track project progress, issues, and resolutions effectively

Skills

Key technologies and capabilities for this role

Electronics PackagingAdvanced Packaging TechnologiesMaterial SelectionProcess EngineeringVendor ManagementPackage QualificationTestingValidationProject Management

Questions & Answers

Common questions about this position

What is the compensation range for this role?

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets, with offers aligning based on experience, skills, and education.

Is this role remote or hybrid, and where is it based?

This role is hybrid, based in Taiwan or Toronto, ON.

What skills and experience are required for this position?

Candidates need 5-10 years of experience in electronics packaging across process, material selection, and advanced packaging technologies, along with strong organizational skills, proactive problem-solving, excellent communication, and the ability to thrive in a fast-paced environment.

What is the company culture like at Tenstorrent?

Tenstorrent values collaboration, curiosity, and a commitment to solving hard problems, with a diverse team of technologists passionate about building the best AI platform in a dynamic, innovative environment.

What makes a strong candidate for this Technical Program Manager role?

A strong candidate has 5-10 years in electronics packaging, experience managing complex technical projects and vendors, excellent communication for cross-functional collaboration, and the ability to prioritize in a fast-paced setting; candidates at various experience levels are welcome and will be assessed during interviews.

Tenstorrent

Builds advanced computers for AI applications

About Tenstorrent

Tenstorrent builds advanced computers specifically designed for artificial intelligence applications. Their products include high-performance computing systems that utilize specialized hardware and software solutions, leveraging technologies like ASIC design and RISC-V architecture. Unlike many competitors, Tenstorrent focuses on integrating neural network compilers into their systems, enhancing the efficiency of AI computations. The company's goal is to advance the capabilities of AI computing, serving clients in the AI and computing sectors while generating revenue through the sale of their specialized systems and services.

Toronto, CanadaHeadquarters

2016Year Founded

$1,297.7MTotal Funding

SERIES_DCompany Stage

Hardware, AI & Machine LearningIndustries

501-1,000Employees

Benefits

Hybrid Work Options

Risks

Competition from established AI hardware companies like Nvidia could impact market share.

Reliance on open-source software may delay product development timelines.

Geopolitical tensions in South Korea and Japan could disrupt Tenstorrent's supply chains.

Differentiation

Tenstorrent leverages RISC-V technology for flexible, open-source AI hardware solutions.

The company partners with BOS Semiconductors to develop next-gen automotive AI chips.

Tenstorrent's global presence includes offices in key tech hubs like Silicon Valley and Tokyo.

Upsides

RISC-V architecture's growth aligns with Tenstorrent's open-source AI software focus.

Automotive AI chip market growth offers lucrative opportunities for Tenstorrent's BOS partnership.

Increasing demand for HPC systems could expand Tenstorrent's reach beyond tech industries.

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