Associate Engineer at Bond

Woburn, Massachusetts, United States

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Not SpecifiedCompensation

Junior (1 to 2 years)Experience Level

Full TimeJob Type

UnknownVisa

Aerospace, Military, Alternative Energy, MedicalIndustries

Requirements

Employment Type: Full time
Location: On-Site in Woburn

Responsibilities

Design assemblies
Assist in system testing
Work with subject matter experts in design, mechanical and refrigeration engineering
Data collection and analysis
Participate in design and other engineering reviews
Assist in minor assembly tasks and product testing
Assist in R&D activities as required
Assist in other tasks as assigned

Skills

Key technologies and capabilities for this role

Assembly DesignSystem TestingData AnalysisEngineering ReviewsProduct TestingR&DMechanical EngineeringRefrigeration Engineering

Questions & Answers

Common questions about this position

What compensation is offered for the Associate Engineer position?

Boyd offers a competitive base salary, a performance-based bonus, and a comprehensive benefits package.

Is this position remote or on-site?

The position is on-site.

What are the main responsibilities for this role?

Responsibilities include designing assemblies, assisting in system testing, working with subject matter experts in design, mechanical and refrigeration engineering, data collection and analysis, participating in engineering reviews, assisting in minor assembly tasks and product testing, and supporting R&D activities.

What is the company culture like at Boyd Corporation?

Boyd Corporation celebrates diversity and is committed to creating an inclusive environment for all employees.

What kind of experience or skills make a strong candidate for this role?

Strong candidates will have interest or background in engineering, particularly in design, mechanical, refrigeration engineering, system testing, data analysis, and R&D activities within high-performance cooling products for aerospace, military, alternative energy, and medical markets.

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters

2019Year Founded

$40.9MTotal Funding

SERIES_ACompany Stage

Fintech, Financial ServicesIndustries

51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.

Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.

FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.

The platform ensures compliance with federal regulations, easing the burden on clients.

Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.

Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.

Rising interest in secured credit cards opens new markets for Bond.

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