Senior Package Layout Engineer at NVIDIA

Hsinchu City, Hsinchu City, Taiwan

NVIDIA Logo
Not SpecifiedCompensation
Senior (5 to 8 years)Experience Level
Full TimeJob Type
UnknownVisa
Semiconductors, TechnologyIndustries

Requirements

  • B.Sc. in Electrical Engineering or equivalent experience
  • Minimum of 5+ years hands-on experience in Package and/or PCB Layout, including high-speed design signal integrity practices and PDN designing/planning
  • Experience in substrate layout of wire bond and flip chip packages (preferred)
  • Knowledge in substrates or board manufacturing processes
  • Significant background with APD or SiP and/or other PCB layout tools
  • English communication skills (written and verbal)
  • Ways to stand out
  • Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools
  • Familiarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting)

Responsibilities

  • Collaborate to implement high-speed and PDN design for ASIC packages
  • Develop symbols, pad stacks, and perform substrate package routing, placement, stack-up, reference plane, and power distribution using APD or SiP tools
  • Optimize package pin out incorporating system-level trade-offs of pin assignments
  • Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations
  • Work in close cooperation with SI/PI/HW design teams and product teams
  • Handle planning, stakeholder management, and lead projects from start to finish

Skills

Key technologies and capabilities for this role

APDSiPPCB LayoutSubstrate LayoutPDN DesignSignal IntegrityWire BondFlip ChipAnsys SIwaveHFSSCadence SigrityPowerSI

Questions & Answers

Common questions about this position

What experience is required for the Senior Package Layout Engineer role?

A minimum of 5+ years hands-on experience in Package or/and PCB Layout is required, including high speed design signal integrity practice and PDN designing and planning. Experience in substrate layout of wire bond and flip chip packages is preferred, along with significant background with APD or SiP and/or other PCB layout tools.

What is the salary or compensation for this position?

This information is not specified in the job description.

Is this a remote position or does it require working in an office?

This information is not specified in the job description.

What is the company culture like at NVIDIA for this team?

NVIDIA has forward-thinking and hardworking people, with rapidly growing exclusive engineering teams in a diverse work environment. The role involves close collaboration with Technical Package Lead, SI/PI/HW design teams, and product teams.

What skills will help me stand out as a candidate?

Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools, along with familiarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting), will help you stand out.

NVIDIA

Designs GPUs and AI computing solutions

About NVIDIA

NVIDIA designs and manufactures graphics processing units (GPUs) and system on a chip units (SoCs) for various markets, including gaming, professional visualization, data centers, and automotive. Their products include GPUs tailored for gaming and professional use, as well as platforms for artificial intelligence (AI) and high-performance computing (HPC) that cater to developers, data scientists, and IT administrators. NVIDIA generates revenue through the sale of hardware, software solutions, and cloud-based services, such as NVIDIA CloudXR and NGC, which enhance experiences in AI, machine learning, and computer vision. What sets NVIDIA apart from competitors is its strong focus on research and development, allowing it to maintain a leadership position in a competitive market. The company's goal is to drive innovation and provide advanced solutions that meet the needs of a diverse clientele, including gamers, researchers, and enterprises.

Santa Clara, CaliforniaHeadquarters
1993Year Founded
$19.5MTotal Funding
IPOCompany Stage
Automotive & Transportation, Enterprise Software, AI & Machine Learning, GamingIndustries
10,001+Employees

Benefits

Company Equity
401(k) Company Match

Risks

Increased competition from AI startups like xAI could challenge NVIDIA's market position.
Serve Robotics' expansion may divert resources from NVIDIA's core GPU and AI businesses.
Integration of VinBrain may pose challenges and distract from NVIDIA's primary operations.

Differentiation

NVIDIA leads in AI and HPC solutions with cutting-edge GPU technology.
The company excels in diverse markets, including gaming, data centers, and autonomous vehicles.
NVIDIA's cloud services, like CloudXR, offer scalable solutions for AI and machine learning.

Upsides

Acquisition of VinBrain enhances NVIDIA's AI capabilities in the healthcare sector.
Investment in Nebius Group boosts NVIDIA's AI infrastructure and cloud platform offerings.
Serve Robotics' expansion, backed by NVIDIA, highlights growth in autonomous delivery services.

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