Senior Manufacturing Test Engineer
NVIDIASalary not specified
Full Time
Senior (5 to 8 years)
Not SpecifiedCompensation
Senior (5 to 8 years)Experience Level
Full TimeJob Type
UnknownVisa
Manufacturing, Robotics, Autonomous VehiclesIndustries
Requirements
- Bachelor’s degree in engineering or related field
- Minimum 3-5 years’ experience in wire bond, die placement, adhesive displacement, and encapsulation
- Experience in operating high precision wire bonding machine, die placement, dispenser machine
- Experience in Micro-Electronic and SMT (Surface Mount Technology) environment
- Experience in operating DATACON, MRSI, etc
Responsibilities
- Perform DFM (Design for Manufacturing) and DFMEA/PFMEA (Design for Manufacturability/Process Failure Mode and Effects Analysis) reviews with product design engineers, CM (Manufacturing), and suppliers
- Develop process recipe, tooling, and equipment requirements for production
- Perform failure analysis and solutions
- International travel may be required
Skills
Wire Bonding
Die Placement
Adhesive Displacement
Encapsulation
Wire Bonding Machine
Die Placement Machine
Dispenser Machine
DFM
DFMEA
PFMEA
Failure Analysis
Process Design
Tooling Development
Ouster
Manufactures high-resolution lidar sensors
About Ouster
Ouster produces high-resolution, low-cost lidar sensors used in autonomous vehicles, robotics, mapping, and industrial applications. These sensors measure distances using laser light, providing detailed environmental data. Ouster differentiates itself through high-volume manufacturing and global distribution, allowing it to meet the rising demand for sensor technology efficiently. The company's goal is to lead the lidar industry by offering innovative products and supporting clients in integrating these technologies into their operations.
San Francisco, CaliforniaHeadquarters
2015Year Founded
$222.8MTotal Funding
IPOCompany Stage
Robotics & Automation, Automotive & Transportation, Enterprise SoftwareIndustries
201-500Employees
Risks
Increased competition from Chinese manufacturers like Hesai may impact Ouster's market share.
Ongoing legal battles with Velodyne could result in financial liabilities.
The proposed merger with Velodyne carries risks of integration challenges.
Differentiation
Ouster's digital lidar design leverages Moore's Law for enhanced 3D sensing capabilities.
The L3 chip innovation offers faster, more powerful lidar applications.
Ouster's high-resolution sensors are ideal for complex environments and precise applications.
Upsides
Growing demand for lidar in smart city projects boosts Ouster's market potential.
Partnerships with cloud providers enhance Ouster's data processing capabilities.
The rise of digital twins in industry drives demand for Ouster's high-resolution sensors.
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