Package Design Engineer at Celestial AI

Santa Clara, California, United States

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Not SpecifiedCompensation

Mid-level (3 to 4 years), Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductors, AI Hardware, PhotonicsIndustries

Requirements

BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related field
Experienced Package Designer with expertise in heterogeneous integration
Strong background in semiconductor packaging design

Responsibilities

Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Celestial AI products
Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging
Support pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation
Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes
Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures
Netlist management for heterogeneous chiplet assemblies using latest EDA solutions
Support activities related to production and assembly of IC packages with substrate suppliers and OSATs
Work with cross-functional teams and support package integration and architecture efforts with vendors
Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design
Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI
Cross-functional design collaboration with multiple engineering groups, such as Packaging, ASIC, AMS, Photonics, and external partners to ensure design for manufacturing, assembly, reliability, and cost

Skills

Package Design

Heterogeneous Integration

Semiconductor Packaging

2.5D Packaging

Optical Interconnect

Chiplets

Interposers

ASIC Design

HBM Memory

Celestial AI

Optical interconnects for high-performance computing

About Celestial AI

Celestial AI focuses on high-performance computing for hyperscale data centers with its technology called Photonic Fabric™, an optical compute interconnect. This technology reduces DRAM requirements by up to 35% and lowers power consumption while increasing bandwidth capacity, which is essential for multi-tenant cloud environments. Additionally, it allows for the disaggregation of High Bandwidth Memory (HBM) using optics instead of traditional connections. The goal is to provide optical connectivity that supports advancements in Generative AI and complex workloads.

Sunnyvale, CaliforniaHeadquarters

2020Year Founded

$329.6MTotal Funding

SERIES_CCompany Stage

Data & Analytics, Hardware, AI & Machine LearningIndustries

51-200Employees

Benefits

Health Insurance

Vision Insurance

Dental Insurance

Life Insurance

Company Equity

Risks

Emerging competition from companies like Lightmatter and Ayar Labs.

Potential integration challenges with existing data center infrastructure.

Dependency on limited suppliers for photonic components poses supply chain risks.

Differentiation

Celestial AI's Photonic Fabric™ offers unique optical compute interconnect technology.

The company reduces DRAM requirements by up to 35%, saving billions annually.

Celestial AI enables disaggregation of HBM over optics, enhancing bandwidth capacity.

Upsides

Acquisition of Rockley Photonics' IP strengthens Celestial AI's competitive position.

$175 million Series C funding supports further innovation and market expansion.

Growing demand for energy-efficient solutions aligns with Celestial AI's sustainable focus.

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