Industrial Engineer at Bond

Woburn, Massachusetts, United States

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Not SpecifiedCompensation

Mid-level (3 to 4 years)Experience Level

Full TimeJob Type

UnknownVisa

Aerospace, Defense, Medical, Electronics, Industrial, Engineered Materials, Thermal ManagementIndustries

Requirements

Bachelor’s degree in Industrial Engineering, Manufacturing Engineering, or related field
3+ years of experience in continuous improvement, lean manufacturing, or industrial engineering
Hands-on experience with Lean/TPS tools (5S, Kaizen, Standard Work, Value Stream Mapping, etc.)
Strong analytical and problem-solving skills; ability to translate data into actionable improvements
Experience with capital investment planning and project management
Excellent communication skills with the ability to influence across departments and levels
Experience in an assembly/manufacturing environment (aerospace/defense preferred)
Six Sigma Green Belt or higher certification a plus

Responsibilities

Lead continuous improvement initiatives in the assembly department, with a focus on productivity, flow, and defect reduction
Support and facilitate plantwide efficiency projects that improve safety, quality, delivery, and cost performance
Partner with production, engineering, and quality teams to standardize best practices and implement lean methodologies
Conduct time studies, root cause analyses, and value stream mapping to identify opportunities and eliminate waste
Drive kaizen events and train employees in problem-solving tools (5S, A3, PDCA, standard work, etc.)
Develop business cases for capital investments, including ROI and payback analyses
Manage capital projects from concept through implementation, ensuring alignment with plant strategy and CI goals
Track improvement and investment metrics, report progress to leadership, and ensure gains are sustained over time
Champion a culture of continuous improvement and employee engagement across all levels of the plant

Skills

Lean

Six Sigma

Toyota Production System

TPS

Continuous Improvement

Kaizen

Capital Investment Planning

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters

2019Year Founded

$40.9MTotal Funding

SERIES_ACompany Stage

Fintech, Financial ServicesIndustries

51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.

Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.

FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.

The platform ensures compliance with federal regulations, easing the burden on clients.

Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.

Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.

Rising interest in secured credit cards opens new markets for Bond.

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