IC Senior Packaging Engineer at NVIDIA

Hsinchu City, Hsinchu City, Taiwan

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Not SpecifiedCompensation

Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductor, Networking, TechnologyIndustries

Requirements

BSc in Mechanical/Materials Engineering (or related field) or equivalent experience
5+ years of relevant experience in semiconductor packaging across development and manufacturing; background at substrate manufacturing or assembly sites is a plus
Basic design proficiency with 2D ArtiosCAD and 3D CAD (NX/SolidWorks/Creo)
DFM expertise; solid understanding of tooling design, manufacturing processes, material properties, and metrology tools
Strong focus on quality, robustness, and manufacturability
High self-learning and self-motivation; fosters continuous improvement with a proactive approach
Leadership capability to drive cross-company, cross-functional projects across multiple locations
Curious, creative problem solver; well organized and able to manage multiple priorities
Strong English communication skills (verbal and written)
Ways to stand out
Background in engineering semiconductor manufacturing processes
Experience in a manufacturing environment and with manufacturing statistics tools
Hands-on mechanical FEA experience—ideally developing simulations in Ansys
Proficiency with mechanical CAD (e.g., SolidWorks)
NPI leadership, including close collaboration with Operations on manufacturing and quality. Proven ability to manage multiple packaging projects in cross-functional settings and teams

Responsibilities

Leading development of cutting-edge microelectronics packaging for NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance
Review manufacturability readiness at each milestone
Work with world-leading vendors to develop highly challenging packaging solutions
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Join and lead task forces to investigate and support production excursions, failure analysis, reliability issues, and establish quality standards
Monitor substrate and assembly production KPIs and collaborate with cross-functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain
Provide technical leadership across the entire product lifecycle—from concept through NPI and ramp—driving DFM, manufacturing feedback, and process optimization to strengthen supply robustness and quality
Responsibilities include schedule planning and delivery management, cost and risk ownership, and hands-on resolution of packaging, manufacturing, and electrical design issues

Skills

IC Packaging

ASIC Packaging

Signal Integrity

Package Layout

DFM

Failure Analysis

Reliability Engineering

Yield Improvement

Process Optimization

Microelectronics Packaging

Substrate Design

Assembly Production

NVIDIA

Designs GPUs and AI computing solutions

About NVIDIA

NVIDIA designs and manufactures graphics processing units (GPUs) and system on a chip units (SoCs) for various markets, including gaming, professional visualization, data centers, and automotive. Their products include GPUs tailored for gaming and professional use, as well as platforms for artificial intelligence (AI) and high-performance computing (HPC) that cater to developers, data scientists, and IT administrators. NVIDIA generates revenue through the sale of hardware, software solutions, and cloud-based services, such as NVIDIA CloudXR and NGC, which enhance experiences in AI, machine learning, and computer vision. What sets NVIDIA apart from competitors is its strong focus on research and development, allowing it to maintain a leadership position in a competitive market. The company's goal is to drive innovation and provide advanced solutions that meet the needs of a diverse clientele, including gamers, researchers, and enterprises.

Santa Clara, CaliforniaHeadquarters

1993Year Founded

$19.5MTotal Funding

IPOCompany Stage

Automotive & Transportation, Enterprise Software, AI & Machine Learning, GamingIndustries

10,001+Employees

Benefits

Company Equity

401(k) Company Match

Risks

Increased competition from AI startups like xAI could challenge NVIDIA's market position.

Serve Robotics' expansion may divert resources from NVIDIA's core GPU and AI businesses.

Integration of VinBrain may pose challenges and distract from NVIDIA's primary operations.

Differentiation

NVIDIA leads in AI and HPC solutions with cutting-edge GPU technology.

The company excels in diverse markets, including gaming, data centers, and autonomous vehicles.

NVIDIA's cloud services, like CloudXR, offer scalable solutions for AI and machine learning.

Upsides

Acquisition of VinBrain enhances NVIDIA's AI capabilities in the healthcare sector.

Investment in Nebius Group boosts NVIDIA's AI infrastructure and cloud platform offerings.

Serve Robotics' expansion, backed by NVIDIA, highlights growth in autonomous delivery services.

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