Silicon Packaging Layout Engineer at Celestial AI

Santa Clara, California, United States

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Not SpecifiedCompensation

Mid-level (3 to 4 years), Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductors, AI Hardware, PhotonicsIndustries

Requirements

BS in EE/ECE/MSE/ME/ChemE or related disciplines
4 years of experience in silicon interposer and RDL designs for heterogeneous architectures
Experience working with design tools such as Cadence Virtuoso and Klayout
Familiarity with AutoCAD tools and file formats
Layout experience for various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB
Familiarity with cross-functional packaging areas: Si floor plan, package, assembly design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost
Familiarity with photonics packaging is a plus but not necessary
Experience working with wafer foundries to meet design for manufacturing, yield, and reliability
Experience working with OSATs to meet assembly requirements

Responsibilities

Support Silicon interposer and RDL based design planning and execution for advanced packaging architectures
Support bumpmap and test collateral release for test vehicle and product designs
Netlist management for heterogeneous chiplet assemblies using latest EDA solutions
Support all aspects of silicon layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
Support cross-functional silicon layout needs
Support activities related to silicon manufacturing such as fab design reviews and tape-out aligned with OSAT requirements
Actively support test vehicle definition and design for assembly test vehicles

Skills

Silicon Packaging

Layout Design

Heterogeneous Integration

Semiconductor Packaging

2.5D Packaging

Photonic Fabric

Optical Interposers

Chiplets

ASIC Design

HBM

Celestial AI

Optical interconnects for high-performance computing

About Celestial AI

Celestial AI focuses on high-performance computing for hyperscale data centers with its technology called Photonic Fabric™, an optical compute interconnect. This technology reduces DRAM requirements by up to 35% and lowers power consumption while increasing bandwidth capacity, which is essential for multi-tenant cloud environments. Additionally, it allows for the disaggregation of High Bandwidth Memory (HBM) using optics instead of traditional connections. The goal is to provide optical connectivity that supports advancements in Generative AI and complex workloads.

Sunnyvale, CaliforniaHeadquarters

2020Year Founded

$329.6MTotal Funding

SERIES_CCompany Stage

Data & Analytics, Hardware, AI & Machine LearningIndustries

51-200Employees

Benefits

Health Insurance

Vision Insurance

Dental Insurance

Life Insurance

Company Equity

Risks

Emerging competition from companies like Lightmatter and Ayar Labs.

Potential integration challenges with existing data center infrastructure.

Dependency on limited suppliers for photonic components poses supply chain risks.

Differentiation

Celestial AI's Photonic Fabric™ offers unique optical compute interconnect technology.

The company reduces DRAM requirements by up to 35%, saving billions annually.

Celestial AI enables disaggregation of HBM over optics, enhancing bandwidth capacity.

Upsides

Acquisition of Rockley Photonics' IP strengthens Celestial AI's competitive position.

$175 million Series C funding supports further innovation and market expansion.

Growing demand for energy-efficient solutions aligns with Celestial AI's sustainable focus.

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