Senior Photonics Assembly Engineer

Candidates must possess a degree in Optics, Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field with equivalent experience. A minimum of 7 years of optical assembly, test, or packaging experience is required, along with a strong background in Silicon Photonics design, fabrication, test, CoWoS, and assembly. Proven hands-on experience in Photonics assembly development, particularly optical fiber alignment at chip or package-scale, building and qualifying Photonics assembly equipment, and analyzing assembly data is essential. Strong statistical analysis skills, including data visualization techniques for assembly data analysis and optimization of manufacturing techniques, are necessary. A solid understanding of quality control, statistical process control, and DOE techniques is also required, along with excellent written and oral communication skills. Experience in Silicon Photonics device design or fabrication, familiarity with photonics test structure design, and knowledge of AutoCad, Zemax, or other opto-mechanical software tools, as well as mechanical simulation software like Ansys mechanical, are considered advantageous.