Senior Engineer at Bond

Woburn, Massachusetts, United States

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Not SpecifiedCompensation

Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Refrigeration, Liquid Cooling, EngineeringIndustries

Requirements

Willingness to travel – limited, typically less than 5% per year (domestic and international possible)
Ability to work in an office and laboratory environment, including standing, walking, sitting, hearing, and talking
Physical ability to perform essential functions (reasonable accommodations for disabilities)

Responsibilities

Interface with the design team and customers to understand and develop product specifications
Evaluate trade-offs between performance/functionality, quality, cost, and schedule
Design the refrigeration system by sizing and selecting components and sensors (e.g., compressors, evaporators, condensers, expansion devices, fans)
Design controls for the refrigeration portion of the product
Create refrigeration product schematics
Develop and execute verification test plans
Write test procedures and engineering reports
Create new items and BOMs for the refrigeration portion of the design
Manage the refrigeration portion of the product for new product development, ensuring cost, performance, and schedule goals are achieved
Actively manage risk mitigation efforts
Follow established procedures, drive continuous improvement, and update procedures as necessary
Provide product support from early concept through product development and production
Support failure and root cause analysis of prototype and production products
Interact with global Boyd product team members
Work with mechanical, electrical, and manufacturing engineers through the full product development process (concept to production support), including layout of refrigeration components and piping, support for product structure/enclosure, and testing/debugging

Skills

Refrigeration System Design

Component Selection

Compressors

Evaporators

Condensers

Expansion Devices

TEV

EEV

Refrigeration Controls

Piping Layout

Schematics

BOM

Verification Testing

Test Plans

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters

2019Year Founded

$40.9MTotal Funding

SERIES_ACompany Stage

Fintech, Financial ServicesIndustries

51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.

Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.

FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.

The platform ensures compliance with federal regulations, easing the burden on clients.

Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.

Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.

Rising interest in secured credit cards opens new markets for Bond.

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