Package Reliability Engineer at Celestial AI

Santa Clara, California, United States

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Not SpecifiedCompensation

Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductors, AI, PhotonicsIndustries

Requirements

Strong background in physics of failure (PoF)
Expertise in materials science related to semiconductor packaging
Experience working with OSATs (Original Semiconductor Assembly and Test)
Familiarity with JEDEC and industry reliability standards
Ability to conduct stress testing (e.g., thermal cycling, humidity, electromigration)

Responsibilities

Conduct physics of failure (PoF)-based reliability modeling for 2.5D/3D advanced packaging
Assess package reliability risks from thermal, mechanical, and electrical stressors
Define and execute stress test plans to validate package robustness
Work closely with OSAT partners to drive package reliability improvements, process optimizations, and yield enhancements
Define reliability requirements, review test methodologies, and ensure OSAT compliance with JEDEC and industry standards
Monitor and evaluate OSAT performance in executing reliability qualifications and failure analysis

Skills

Key technologies and capabilities for this role

2.5D Packaging3D PackagingPhysics of FailureMaterials ScienceReliability EngineeringAdvanced PackagingChipletsOptical InterposersHBM MemorySemiconductor Assembly

Questions & Answers

Common questions about this position

Is this position remote or hybrid?

The position is hybrid.

What salary or compensation does this role offer?

This information is not specified in the job description.

What key skills are required for the Package Reliability Engineer role?

Required skills include a strong background in physics of failure (PoF), expertise in materials science related to semiconductor packaging, experience working with OSATs, familiarity with JEDEC and industry reliability standards, and ability to conduct stress testing such as thermal cycling, humidity, and electromigration.

What kind of team collaboration is involved in this role?

The role requires collaboration with external assembly and test partners, internal design, process, and failure analysis teams, and suppliers to ensure reliability and manufacturability.

What makes a strong candidate for this Package Reliability Engineer position?

A strong candidate has experience in 2.5D/3D advanced packaging, a strong background in physics of failure and materials science, and hands-on experience working closely with OSATs to drive reliability improvements.

Celestial AI

Optical interconnects for high-performance computing

About Celestial AI

Celestial AI focuses on high-performance computing for hyperscale data centers with its technology called Photonic Fabric™, an optical compute interconnect. This technology reduces DRAM requirements by up to 35% and lowers power consumption while increasing bandwidth capacity, which is essential for multi-tenant cloud environments. Additionally, it allows for the disaggregation of High Bandwidth Memory (HBM) using optics instead of traditional connections. The goal is to provide optical connectivity that supports advancements in Generative AI and complex workloads.

Sunnyvale, CaliforniaHeadquarters

2020Year Founded

$329.6MTotal Funding

SERIES_CCompany Stage

Data & Analytics, Hardware, AI & Machine LearningIndustries

51-200Employees

Benefits

Health Insurance

Vision Insurance

Dental Insurance

Life Insurance

Company Equity

Risks

Emerging competition from companies like Lightmatter and Ayar Labs.

Potential integration challenges with existing data center infrastructure.

Dependency on limited suppliers for photonic components poses supply chain risks.

Differentiation

Celestial AI's Photonic Fabric™ offers unique optical compute interconnect technology.

The company reduces DRAM requirements by up to 35%, saving billions annually.

Celestial AI enables disaggregation of HBM over optics, enhancing bandwidth capacity.

Upsides

Acquisition of Rockley Photonics' IP strengthens Celestial AI's competitive position.

$175 million Series C funding supports further innovation and market expansion.

Growing demand for energy-efficient solutions aligns with Celestial AI's sustainable focus.

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