Package Reliability Engineer at Celestial AI

Santa Clara, California, United States

Celestial AI Logo
Not SpecifiedCompensation
Senior (5 to 8 years)Experience Level
Full TimeJob Type
UnknownVisa
Semiconductors, AI, PhotonicsIndustries

Requirements

  • Strong background in physics of failure (PoF)
  • Expertise in materials science related to semiconductor packaging
  • Experience working with OSATs (Original Semiconductor Assembly and Test)
  • Familiarity with JEDEC and industry reliability standards
  • Ability to conduct stress testing (e.g., thermal cycling, humidity, electromigration)

Responsibilities

  • Conduct physics of failure (PoF)-based reliability modeling for 2.5D/3D advanced packaging
  • Assess package reliability risks from thermal, mechanical, and electrical stressors
  • Define and execute stress test plans to validate package robustness
  • Work closely with OSAT partners to drive package reliability improvements, process optimizations, and yield enhancements
  • Define reliability requirements, review test methodologies, and ensure OSAT compliance with JEDEC and industry standards
  • Monitor and evaluate OSAT performance in executing reliability qualifications and failure analysis

Skills

2.5D Packaging
3D Packaging
Physics of Failure
Materials Science
Reliability Engineering
Advanced Packaging
Chiplets
Optical Interposers
HBM Memory
Semiconductor Assembly

Celestial AI

Optical interconnects for high-performance computing

About Celestial AI

Celestial AI focuses on high-performance computing for hyperscale data centers with its technology called Photonic Fabric™, an optical compute interconnect. This technology reduces DRAM requirements by up to 35% and lowers power consumption while increasing bandwidth capacity, which is essential for multi-tenant cloud environments. Additionally, it allows for the disaggregation of High Bandwidth Memory (HBM) using optics instead of traditional connections. The goal is to provide optical connectivity that supports advancements in Generative AI and complex workloads.

Sunnyvale, CaliforniaHeadquarters
2020Year Founded
$329.6MTotal Funding
SERIES_CCompany Stage
Data & Analytics, Hardware, AI & Machine LearningIndustries
51-200Employees

Benefits

Health Insurance
Vision Insurance
Dental Insurance
Life Insurance
Company Equity

Risks

Emerging competition from companies like Lightmatter and Ayar Labs.
Potential integration challenges with existing data center infrastructure.
Dependency on limited suppliers for photonic components poses supply chain risks.

Differentiation

Celestial AI's Photonic Fabric™ offers unique optical compute interconnect technology.
The company reduces DRAM requirements by up to 35%, saving billions annually.
Celestial AI enables disaggregation of HBM over optics, enhancing bandwidth capacity.

Upsides

Acquisition of Rockley Photonics' IP strengthens Celestial AI's competitive position.
$175 million Series C funding supports further innovation and market expansion.
Growing demand for energy-efficient solutions aligns with Celestial AI's sustainable focus.

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