Head of Platform Mechanical & Thermal Engineering at Etched.ai

San Jose, California, United States

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Not SpecifiedCompensation

Expert & Leadership (9+ years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductors, AI Hardware, DatacenterIndustries

Requirements

10+ years of experience in mechanical and thermal engineering for high-performance computing systems, with at least 5+ years in leadership roles
Proven expertise in liquid cooling architectures for high-power density ASICs or GPUs
Proficiency with Siemens NX for 3D CAD; experience scaling CAD/PLM environments across teams
Hands-on experience with Flowtherm, Ansys Icepak, and MacroFlow for CFD and rack-level thermal modeling
Strong record of bringing complex server or datacenter platforms from concept through production
Deep understanding of thermal validation, fluid integrity testing, and mechanical reliability for liquid-cooled systems
Bachelor’s or Master’s in Mechanical Engineering, Thermal Engineering, or related field

Responsibilities

Build, mentor, and scale a team of mechanical and thermal engineers
Define hiring plans and technical standards for advanced cooling and mechanical design
Foster a culture of engineering rigor and cross-disciplinary collaboration
Own the design of server enclosures, modules, and racks optimized for high-power ASICs
Drive liquid cooling solutions (cold plates, manifolds, quick-disconnects, CDU integration) as well as air-assisted hybrid cooling where applicable
Ensure mechanical designs meet standards for manufacturability, serviceability, and reliability under extreme thermal loads
Deploy and optimize Siemens NX for CAD/PLM workflows, with integrated libraries and release processes
Establish and scale simulation infrastructure, including Flowtherm and Ansys Icepak for detailed CFD of component and system thermal behavior, and MacroFlow for rack-level and datacenter fluid dynamics modeling
Standardize validation workflows linking simulation to hardware measurements
Define test plans for thermal performance, fluid integrity, and long-term reliability of liquid cooling systems
Oversee lab infrastructure for thermal and mechanical validation at both module and rack scale
Partner with electrical and system validation teams to ensure holistic system readiness
Collaborate closely with silicon, electrical, and system engineers to co-optimize cooling with chip and board power delivery
Engage with suppliers, ODMs, and datacenter partners to align design with deployment environments
Represent mechanical and thermal engineering in executive reviews, providing visibility into risks, milestones, and resources

Skills

Key technologies and capabilities for this role

Siemens NXCFDLiquid CoolingCold PlatesManifoldsQuick-DisconnectsCDU IntegrationThermal ManagementMechanical DesignRack SimulationPLM WorkflowsServer Enclosures

Questions & Answers

Common questions about this position

Is this position remote or onsite?

The position is onsite.

What salary or compensation is offered for this role?

This information is not specified in the job description.

What experience and skills are required for the Head of Platform Mechanical & Thermal Engineering role?

Candidates should have 10+ years of experience, expertise in liquid cooling technologies like cold plates and manifolds, proficiency with Siemens NX for CAD/PLM, and experience with CFD tools such as Flowtherm, Ansys Icepak, and MacroFlow.

What is the company culture like at Etched?

Etched fosters a culture of engineering rigor and cross-disciplinary collaboration.

What makes a strong candidate for this position?

A strong candidate has 10+ years of experience and can build and scale a mechanical and thermal engineering team focused on advanced cooling for high-power ASICs, with expertise in liquid cooling, CAD tools like Siemens NX, and CFD simulation.

Etched.ai

Develops servers for transformer inference

About Etched.ai

The company specializes in developing powerful servers for transformer inference, utilizing transformer architecture integrated into their chips to achieve highly efficient and advanced technology. The main technologies used in the product are transformer architecture and advanced chip integration.

Cupertino, CA, USAHeadquarters

2022Year Founded

$5.4MTotal Funding

SEEDCompany Stage

HardwareIndustries

11-50Employees