Associate Engineer-2 at Bond

Woburn, Massachusetts, United States

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Not SpecifiedCompensation

Junior (1 to 2 years)Experience Level

Full TimeJob Type

UnknownVisa

Aerospace, Military, Alternative Energy, MedicalIndustries

Requirements

No specific qualifications listed (entry-level engineering role)

Responsibilities

Generate work instructions
Design tooling and fixtures
Assist in disposition QC Tags, DMRs, RMAs, etc
Work with subject matter experts in machining, brazing, heat treating, and welding to improve processes that meet customer requirements and cost/quality goals
Data analysis including CMMs
Review customer documentation packages
Participate in design, RCCA, and other engineering reviews
Assist in minor assembly tasks and product testing
Setup and run 3D printing equipment for metal and plastic
Post printing processing
Monitor material tracking, usage for 3D printing
Minor inspection for products and tooling
Assist in R&D activities as required
Assist in other tasks as assigned

Skills

Key technologies and capabilities for this role

Work InstructionsTooling DesignFixture DesignQC DispositionDMRRMAMachiningBrazingHeat TreatingWeldingData AnalysisCMM3D PrintingPost-ProcessingMaterial TrackingProduct InspectionR&D

Questions & Answers

Common questions about this position

What is the pay for the Associate Engineer-2 position?

The position offers a competitive base salary of $22.00-$25.00 per hour, along with a performance-based bonus.

Is this role remote or on-site?

This is an on-site position.

What skills or experiences are required for this Associate Engineer role?

The role involves hands-on engineering tasks like generating work instructions, designing tooling and fixtures, data analysis including CMMs, working with machining and welding experts, and operating 3D printing equipment.

What is the company culture like at Boyd Corporation?

Boyd is committed to creating an inclusive environment for all employees and celebrates diversity.

What benefits does Boyd offer?

Boyd provides a comprehensive benefits package.

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters

2019Year Founded

$40.9MTotal Funding

SERIES_ACompany Stage

Fintech, Financial ServicesIndustries

51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.

Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.

FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.

The platform ensures compliance with federal regulations, easing the burden on clients.

Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.

Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.

Rising interest in secured credit cards opens new markets for Bond.

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