Senior Electronics Engineer (VideoRay)
AeroVironment- Full Time
- Senior (5 to 8 years)
Candidates must possess a Bachelor’s degree in Biomedical Engineering or a related field, and a minimum of 8 years of experience in board or system design, with preferred experience in package design. A strong understanding of transmission line theory, power delivery, and signal integrity is desired, along with proficiency in programming and scripting languages such as Perl, Python, and Tcl. Familiarity with Cadence and Excel is also helpful.
The Senior Packaging Technical Engineer will define the chip pad ring, substrate interconnect scheme, and lead the package layout design process, collaborating with various engineering teams to define a chip floor plan, pad ring, substrate, and ball out. They will communicate effectively with these teams, ensuring a robust and world-class electrical package is implemented, and will actively seek to solve complex technical problems.
Designs GPUs and AI computing solutions
NVIDIA designs and manufactures graphics processing units (GPUs) and system on a chip units (SoCs) for various markets, including gaming, professional visualization, data centers, and automotive. Their products include GPUs tailored for gaming and professional use, as well as platforms for artificial intelligence (AI) and high-performance computing (HPC) that cater to developers, data scientists, and IT administrators. NVIDIA generates revenue through the sale of hardware, software solutions, and cloud-based services, such as NVIDIA CloudXR and NGC, which enhance experiences in AI, machine learning, and computer vision. What sets NVIDIA apart from competitors is its strong focus on research and development, allowing it to maintain a leadership position in a competitive market. The company's goal is to drive innovation and provide advanced solutions that meet the needs of a diverse clientele, including gamers, researchers, and enterprises.