PIE Engineer at Bond

Vadodara, Gujarat, India

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Not SpecifiedCompensation

Mid-level (3 to 4 years)Experience Level

Full TimeJob Type

UnknownVisa

ManufacturingIndustries

Requirements

Must include ISO Awareness
Ability to determine safe and best possible work process routing to facilitate shortest manufacturing cycle time and lowest shop cost
Ability to make and modify VMC program manually and in CAM independently, including setting and FAI for new product
Basic knowledge of CMM
Skill in operating CNC machinery and tooling as well as precision measurement tools
Proficient with Microsoft Office, Microsoft Outlook, CAD (SolidWorks), CAM (Mastercam), and other common software packages

Responsibilities

Provide support to all departments as needed to plan correct processes for all parts as requested
Provide necessary support to all departments through MRB activities and other quality directives to correct Manufacturing or Engineering issues and produce a Quality product
Analyse current and/or potential manufacturing practices and implement or suggest ideas as required to reduce cost
Perform periodic evaluation of product Quality either in process or at M.R.B., and coordinate any manufacturing changes needing implementation for correction of problem or shop floor discipline issues with appropriate shop Manager or Supervisor
Generate and update CNC process spec/documentation such as detailed step-by-step work instructions, SOP etc., record CNC process cycle run time, monitor and manage, and get approval from concerned engineer
Reduce variability in manufacturing by providing standard work methods and work instructions
Support and lead continuous improvement, problem solving, and process improvement activities
Remove/minimize waste from the processes
Maintain tools/fixtures list, record, periodically plan repair/rework, calibration, and validate tools/fixture with maintaining history card
Validate tools or fixtures with appropriate trial runs and hand over to production; ensure tool management safety while handling and in operation routine; revalidate in case of any accident/damage to tool
Specify tool-fixture information in routing/SOP/WI to perform operations

Skills

Key technologies and capabilities for this role

CNCVMCCAMCMMFAIMRBISO AwarenessSOPPrecision Measurement ToolsTool Management

Questions & Answers

Common questions about this position

What is the salary for the PIE Engineer position?

This information is not specified in the job description.

Is this a remote position or does it require on-site work?

This is an on-site position.

What key skills are required for this role?

Required skills include proficiency with VMC programming manually and in CAM, operating CNC machinery and precision measurement tools, basic CMM knowledge, CAD (SolidWorks), CAM (Mastercam), and Microsoft Office.

What is the company culture like at Bond?

Boyd Corp is an equal opportunity employer that celebrates diversity and is committed to creating an inclusive environment for all employees.

What makes a strong candidate for this PIE Engineer role?

Strong candidates will have experience in CNC programming (VMC and CAM), operating CNC machinery, process optimization for manufacturing efficiency, and proficiency in SolidWorks, Mastercam, and Microsoft Office, along with ISO awareness.

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters

2019Year Founded

$40.9MTotal Funding

SERIES_ACompany Stage

Fintech, Financial ServicesIndustries

51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.

Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.

FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.

The platform ensures compliance with federal regulations, easing the burden on clients.

Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.

Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.

Rising interest in secured credit cards opens new markets for Bond.

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