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Common questions about this position
The role involves overseeing packaging integration and vendor coordination from design to manufacturing, working with cross-functional teams and OSAT vendors to bring products from concept to NPI and HVM, aligning day-to-day activities, managing build plans using DOE principles, analyzing manufacturing data for yield and failure modes, and supporting path-finding activities.
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Optical interconnects for high-performance computing
Celestial AI focuses on high-performance computing for hyperscale data centers with its technology called Photonic Fabric™, an optical compute interconnect. This technology reduces DRAM requirements by up to 35% and lowers power consumption while increasing bandwidth capacity, which is essential for multi-tenant cloud environments. Additionally, it allows for the disaggregation of High Bandwidth Memory (HBM) using optics instead of traditional connections. The goal is to provide optical connectivity that supports advancements in Generative AI and complex workloads.