Package Integration Engineer at Celestial AI

Santa Clara, California, United States

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Not SpecifiedCompensation

Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductors, Artificial Intelligence, PhotonicsIndustries

Requirements

MS in physical sciences/engineering and 10+ years of relevant industry experience
Exposure to full product life cycle (end to end)
Experience in working with third party foundries and/or OSATs

Responsibilities

Work with cross-functional teams to coordinate package integration, design, manufacturing and reliability efforts of test vehicles and product builds
Work with OSAT (Outsourced Semiconductor Assembly and Test) and other 3rd party vendors to bring product from concept to NPI (New Product Introduction) and HVM (High-Volume Manufacturing)
Align day-to-day activities of individual contributors and managers and track progress in project and document management software
Use DOE (Design of Experiment) principles and engineering judgement to propose and manage material build plans to support process development, material selection, bringup, test, and reliability efforts
Analyze manufacturing data (inline monitors, test, third party updates) to provide source-of-truth reports on yield, failure modes and development progress
Participate in and support path-finding activities in package assembly and test

Skills

2.5D Packaging

Chiplet Integration

Optical Interconnects

Photonic Fabric

OMIB

HBM Memory

ASIC Design

Yield Improvement

Vendor Coordination

Manufacturing Processes

System Integration

Celestial AI

Optical interconnects for high-performance computing

About Celestial AI

Celestial AI focuses on high-performance computing for hyperscale data centers with its technology called Photonic Fabric™, an optical compute interconnect. This technology reduces DRAM requirements by up to 35% and lowers power consumption while increasing bandwidth capacity, which is essential for multi-tenant cloud environments. Additionally, it allows for the disaggregation of High Bandwidth Memory (HBM) using optics instead of traditional connections. The goal is to provide optical connectivity that supports advancements in Generative AI and complex workloads.

Sunnyvale, CaliforniaHeadquarters

2020Year Founded

$329.6MTotal Funding

SERIES_CCompany Stage

Data & Analytics, Hardware, AI & Machine LearningIndustries

51-200Employees

Benefits

Health Insurance

Vision Insurance

Dental Insurance

Life Insurance

Company Equity

Risks

Emerging competition from companies like Lightmatter and Ayar Labs.

Potential integration challenges with existing data center infrastructure.

Dependency on limited suppliers for photonic components poses supply chain risks.

Differentiation

Celestial AI's Photonic Fabric™ offers unique optical compute interconnect technology.

The company reduces DRAM requirements by up to 35%, saving billions annually.

Celestial AI enables disaggregation of HBM over optics, enhancing bandwidth capacity.

Upsides

Acquisition of Rockley Photonics' IP strengthens Celestial AI's competitive position.

$175 million Series C funding supports further innovation and market expansion.

Growing demand for energy-efficient solutions aligns with Celestial AI's sustainable focus.

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