Bachelor’s or master’s degree in mechanical engineering, materials science, chemical engineering, or a related field. (PhD in a similar field is a plus.)
Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module design and packaging
Knowledge of industry standards and regulations related to power electronics
Strong knowledge of WBG (i.e., GaN and SiC) semiconductor fabrication processes, materials, and equipment
Experienced in automotive industry, advanced product engineering, or electrification in a similar field is a plus
Excellent English skills, mastery of a second language is preferred
Proficiency in MS Office
Ability to work in a multicultural environment and different time zones
Proven adaptability to new technical field and methodology
Passion for engineering with strong fundamentals in mechanical and thermal
Proven experience in both power module design and packaging including die attach, bonding, encapsulation as well as manufacturability and scalability
Self-driven attitude with curiosity towards engineering next generation power electronics
Knowledge of hybrid and electric vehicle architecture design
Understanding of the electric drive system targets from vehicle ecosystem point of view
Good written and oral skills to articulate complex engineering problems
Responsibilities
Responsible for the power module design including mechanical and thermal simulation analyses within advanced systems development projects
Collaborate with global T&I and product line engineering teams to ensure manufacturability and scalability of new power module designs
Drive and execute V&V testing activities needed to correlate with high-fidelity simulations
Contribute to ensure keeping our power electronics integration at the edge through internal and external benchmarking
Assist and support immediate and indirect supervisors as requested
Provide technical support to production teams to resolve process-related issues
As part of our technological intelligence activities, attend and represent BorgWarner at global automotive symposiums