2.5D/3D Process Development Engineer at Celestial AI

Santa Clara, California, United States

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Not SpecifiedCompensation

Mid-level (3 to 4 years), Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Semiconductor, AI, PhotonicsIndustries

Requirements

10+ years of experience in Semiconductor Packaging, Process and Technology Development
Expert level understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate across various package technologies
Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors
Proven track record of bringing products from Technology development
In-depth process engineering and partner management experience
Hands-on experience in wafer process development
Experience working with consumable suppliers
Experience in 2.5D/3D CoW assembly development
Strong project management skills
Strong written and verbal communication skills
Can-do attitude to prioritize and address issues with a high sense of urgency

Responsibilities

Work with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies
Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints
Manage internal and external resources effectively and efficiently towards established corporate milestones
Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI
Manage and drive the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost
Identification and mitigation of risk to new technologies used in product integration
Ensure factory readiness through maturing product during the NPI phase

Skills

Key technologies and capabilities for this role

2.5D packaging3D process developmentprocess engineeringassembly processhigh volume manufacturingfoundry collaborationOSAT managementPhotonic Fabricoptical interconnectsHBM memoryASIC designsystem integration

Questions & Answers

Common questions about this position

What salary or compensation is offered for this role?

This information is not specified in the job description.

Is this position remote or does it require on-site work?

This information is not specified in the job description.

What key skills and experience are required for this role?

The role requires hands-on experience in wafer process development, 2.5D/3D CoW assembly development, working with consumable suppliers, strong project management, and written and verbal communication skills.

What is the company culture like at Celestial AI?

This information is not specified in the job description.

What makes a strong candidate for this Process Development Engineer position?

A strong candidate will have in-depth process engineering experience, partner management skills, a can-do attitude, and the ability to prioritize and address issues with high urgency.

Celestial AI

Optical interconnects for high-performance computing

About Celestial AI

Celestial AI focuses on high-performance computing for hyperscale data centers with its technology called Photonic Fabric™, an optical compute interconnect. This technology reduces DRAM requirements by up to 35% and lowers power consumption while increasing bandwidth capacity, which is essential for multi-tenant cloud environments. Additionally, it allows for the disaggregation of High Bandwidth Memory (HBM) using optics instead of traditional connections. The goal is to provide optical connectivity that supports advancements in Generative AI and complex workloads.

Sunnyvale, CaliforniaHeadquarters

2020Year Founded

$329.6MTotal Funding

SERIES_CCompany Stage

Data & Analytics, Hardware, AI & Machine LearningIndustries

51-200Employees

Benefits

Health Insurance

Vision Insurance

Dental Insurance

Life Insurance

Company Equity

Risks

Emerging competition from companies like Lightmatter and Ayar Labs.

Potential integration challenges with existing data center infrastructure.

Dependency on limited suppliers for photonic components poses supply chain risks.

Differentiation

Celestial AI's Photonic Fabric™ offers unique optical compute interconnect technology.

The company reduces DRAM requirements by up to 35%, saving billions annually.

Celestial AI enables disaggregation of HBM over optics, enhancing bandwidth capacity.

Upsides

Acquisition of Rockley Photonics' IP strengthens Celestial AI's competitive position.

$175 million Series C funding supports further innovation and market expansion.

Growing demand for energy-efficient solutions aligns with Celestial AI's sustainable focus.

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