Senior Electrical Engineer at Bond

Woburn, Massachusetts, United States

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Not SpecifiedCompensation

Senior (5 to 8 years)Experience Level

Full TimeJob Type

UnknownVisa

Manufacturing, Electronics, RefrigerationIndustries

Requirements

Bachelor’s degree in Electrical Engineering, Electro-Mechanical Engineering, Control Systems Engineering, or a related field. Advanced degrees or certifications (e.g., HVAC, refrigeration) a plus
5+ years of experience in designing, programming, and maintaining control systems
3+ years of hands-on experience with PLC programming, HMI development, and integration of sensor networks
Working experience with communications protocols (e.g., RS-232, RS-485, Ethernet, SNMP, REST API)
Strong understanding of control systems, automation, and cooling fundamentals (thermal management, airflow, load balancing)
Proficient in creating and interpreting electrical schematics and control logic diagrams
Excellent analytical, troubleshooting, and problem-solving skills
Effective communication skills, with ability to work collaboratively across multidisciplinary teams
Working knowledge of engineering tools: PLM software, MRP software (Oracle Cloud a plus), mixed signal oscilloscopes, DVMs
Ability to work on-site and travel as needed (limited, typically <5% per year)
Capable of managing multiple projects simultaneously and meeting tight deadlines
Commitment to continuous learning and professional development in cooling and automation technologies

Responsibilities

Design electrical and control panels for liquid cooling systems with high and low voltages, including electrical component selection, schematic and wire run list creation
Design control solutions (functional control logic and PID control loops for temperature, flow, and pressure) and PCBA/PLC control firmware (develop directly or collaborate with software engineer)
Work with engineering team for testing, debugging, and ensuring electrical hardware and firmware meet functional/performance requirements, delivering on schedule and budget
Develop control system architectures
Design and implement control algorithms to dynamically adjust cooling capacity based on real-time data (e.g., temperature, humidity, load)
Integrate sensors, controllers, and actuators to monitor and control cooling systems
Create and update electrical schematics and control diagrams for cooling systems
Program and configure controllers and develop HMI interfaces tailored to cooling operations
Commission, test, and validate control systems for smooth startup and reliable performance
Troubleshoot and resolve control system issues
Collaborate with teams to ensure cooling solutions meet performance requirements and participate in cross-functional design reviews
Assist in planning, scheduling, and budgeting for data center cooling projects and retrofits
Develop and maintain comprehensive documentation for control system designs and programming changes
Provide ongoing support and troubleshooting for production cooling systems
Develop and execute verification test plans
Ensure cooling control systems comply with industry standards and safety regulations (e.g., UL/CE guidelines)

Skills

Electrical Design

Control Panels

PID Control

PLC Programming

PCBA

Firmware Development

HMI Interfaces

Electrical Schematics

Sensors Integration

Actuators

Control Logic

Troubleshooting

Commissioning

Bond

Provides embedded credit solutions for businesses

About Bond

Bond.tech offers embedded credit solutions that enable businesses to quickly launch various card programs, including debit and credit cards. Their platform simplifies the process of issuing physical and virtual cards, verifying customer identities, and ensuring compliance with regulations. Unlike competitors, Bond provides a highly customizable Banking-as-a-Service (BaaS) model that allows clients to tailor financial products to their needs while benefiting from fast support. The goal of Bond is to streamline financial product management and help businesses innovate in the financial sector.

San Francisco, CaliforniaHeadquarters

2019Year Founded

$40.9MTotal Funding

SERIES_ACompany Stage

Fintech, Financial ServicesIndustries

51-200Employees

Risks

Increased competition from Treasury Prime and Grasshopper may erode Bond's market share.

Mastercard and Brim Financial's partnership could threaten Bond's card program offerings.

FIS acquisition may disrupt Bond's existing client relationships or service offerings.

Differentiation

Bond offers a customizable platform for launching card programs quickly and efficiently.

The platform ensures compliance with federal regulations, easing the burden on clients.

Bond's AI-powered infrastructure enhances customer engagement with personalized banking products.

Upsides

Growing demand for embedded finance solutions boosts Bond's market potential.

Partnerships with financial giants like Mastercard enhance Bond's platform capabilities.

Rising interest in secured credit cards opens new markets for Bond.

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